Isuzu North America Corporation (INAC) has established a scholarship program to assist children of employees who plan to continue their education in college or vocational school programs.
The program is administered by Scholarship America®, the nation’s largest designer and manager of scholarships and other education support programs for corporations, foundations, associations, and individuals. Eligibility for individual programs is determined at the sole discretion of the sponsor, and eligible applications are reviewed by Scholarship America’s evaluation team.
Applicants to the J. E. Reilly Scholarship Program must:
If selected as a recipient, the student will receive an award ranging from $1,000 to $4,000. The number of scholarships awarded will be based on SAI selection procedures and the funds available from interest earned on funds deposited with SAI. Only one new award may be granted each year per family (unless there are not enough qualified candidates).
Financial need will be considered in determining the size of the award; however, qualified students demonstrating no financial need are eligible for honorariums at the minimum level.
Awards are renewable up to three years on the basis of satisfactory academic performance in a full-time course of study, satisfactory general school conduct, and continued parental employment.
Awards are for undergraduate study only.
All applicants will be notified in late May.
Scholarship America processes scholarship payments on behalf of Isuzu North America Corporation. Payment is made in August.
Scholarship recipients are selected on the basis of:
All applicants agree to accept the decision as final.
As part of your application, you must upload the following:
NOTE: If you are providing SAT or ACT test scores, and those scores are not listed on your high school transcript, you will need to upload a copy of your test score report(s) separately. If you are uploading a college transcript, those scores are not required.
One online recommendation form must be submitted on your behalf no later than April 22, 2024 3:00 pm Central Time.
Your application is not complete unless all required materials are submitted electronically.